Ceramic PCB Boards
Ceramic PCB boards fare remarkably well in terms of moisture resistance. They have a high thermal conductivity, low coefficient of thermal expansion, and can be produced with thin layers. This allows the board to have a thinner design, which makes it lighter and more compact. This helps reduce the space needed for a given function and also lowers the overall power consumption. Its superior thermal performance, low electrical signal loss, and ability to resist corrosion make it an ideal material for use in harsh environments.
The strength and durability of ceramic pcb board are derived from their chemical and mechanical properties. These materials are strong enough to withstand intense mechanical stress, vibration, and shock, making them suitable for harsh applications. They are also moisture-impervious, so they can withstand prolonged exposure to corrosive substances. They are ideal for a variety of industries, including medical, aerospace, and automotive.
In addition to their robust construction, ceramic PCBs have a low coefficient of thermal expansion and excellent insulation. This enables them to withstand temperatures up to 500°C, and it also means that they will be less likely to experience thermal shock from sudden temperature changes. This is a vital factor for electronic devices, as sudden temperature fluctuations can cause damage or instability in the components inside a circuit board.
How Do Ceramic PCB Boards Fare in Terms of Moisture Resistance?
These boards are manufactured using a process called dry-film-transfer (DFT). The insulating layer, made of dielectric or ceramic materials, is coated with a conductive metal like gold, silver, or the widely used copper. Conductor materials are applied using screen printing, and vias (holes that connect different layers) are drilled using laser techniques. The board is then fired in a high-temperature furnace to fuse the conductive layers and insulating layer together, resulting in a single durable and long-lasting structure.
In addition to being moisture-resistant, ceramic PCBs have a high thermal conductivity that can reach up to 25 W/(m.k). This is significantly higher than the thermal conductivity of FR-4 PCBs, and it allows the ceramic to dispel heat much faster, thus preventing the substrate from overheating and degrading its structural integrity. They also have a lower Young’s modulus than FR4, which makes them less prone to distortion under the same conditions. This feature makes them a good choice for circuit boards that require high levels of automation or are subject to severe environmental pressures. The improved thermal performance and resistance to harsh conditions of a ceramic pcb make it a cost-effective alternative to other PCB materials. This is especially true when it comes to high-frequency data and electricity transmissions, where reliability is critical for the success of a device.